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Quality
Capabilities
Facilities
Production Process Flow
Manufacturing Capabilities
Description International Production  
GENERAL
Capacity (Avg. Daily) S/S 30K SQFT, D/S 15K SQFT, MLB 25K SQFT
Current Utilization 0.7
Panel Sizes (inches) 18*16, 18*24, 20*16, 21*24
Layer Counts 1 TO 36 LAYERS
Minimum DS lot size 250 WORKING PANELS
Minimum 4 layer lot size 200 WORKING
MATERIALS
Laminates FR-1, FR-2, CEM-1, -3 (above for single sided) & FR-4 *Tg 135 to Tg 175 degreeC)
Foils COPPER FOIL
INNER LAYERS
Foil Weight 0.5 TO 4OZ
Minimum Line Width 0.004"
Minimum Spacing 0.004"
OVERALL BRD. THICKNESS
Max. overall brd. thickness 0.125"
Thickness tolerance
Min. dielectric spacing 0.003"
HOLES
Min. drilled hole diam. 0.007
Max. drilled hole diam. 0.25
Plated hole tolerance กำ0.002"
Nonplated hole diam. Tolerance กำ0.002"
Hole/hole location accuracy กำ0.001"
Aspect ratio (finished) 9:01
Other\ Sequential Lamination process
SOLDERMASK
Type: LPI MATTE/GLOSS
Application AUTO SlLKSCREEN
Controlled thickness YES
Registration tolerance กำ0.003"
Min. soldermask dam 0.0023"
Available colors GREEN ,RED,BLUE,BLACK
VIA PLUGGING
Type LPI THERMAL CURED
Max. hole size 0.030"
Available colors LPI THERMAL CURED
LEGEND
Type Silkscreen
Cure UV
Available colors WHITE,BLANK,YELLOW
Min. reproducible line 0.006"
Location accuracy 0.003"
Other
SCORING
Available angle 30,45 DEGREE
Jump score YES
ROUTING
Edge to datum tolerance? กำ0.004"
Min. internal radius RO 4mm
Rout tolerance กำ0.004"
Conductor to board edge <0.007" rout< 0.020" screen?
EDGE BEVELING
Available angles 20 to 60 DEGRESS
Angle tolerance กำ5 DEGREE
Available depth
Depth tolerance กำ0.004"
ELECTRICAL TEST
Pitch
Grid size 0.012"
Fixtureless FLYING PROBE TESTER
Test voltage 150~250V
Net list capability GERBER NET LIST CAD CAM NET LIST
FINISHES
HASL 40u" to 1000u"
Nickel/gold tab fingers NI:50~200u" AU:5~20u"
Deep tank hard gold 8"
ENIG (Electroless Ni /Immersion Au) NI:50~200u" AU:5~20u"
OSP YES
Silver in Hole YES
Immersion Silver YES
Immersion Tin YES
Electrolytic Soft Gold YES
Electroless Soft Gold YES
Carbon Ink YES
Eyelet pins
Other impedance control
LABORATORY
Microsection yes
Thermal stress yes
Ionic contamination yes
X-ray florescence yes
Other
Laser Direct Imaging
Yag and CO2 Laser vias
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