|
|
Description |
International Production |
|
|
GENERAL |
|
Capacity (Avg. Daily) |
S/S 30K SQFT, D/S 15K SQFT, MLB 25K SQFT |
Current Utilization |
0.7 |
Panel Sizes (inches) |
18*16, 18*24, 20*16, 21*24 |
Layer Counts |
1 TO 36 LAYERS |
Minimum DS lot size |
250 WORKING PANELS |
Minimum 4 layer lot size |
200 WORKING |
|
|
MATERIALS |
|
Laminates |
FR-1, FR-2, CEM-1, -3 (above for single sided) & FR-4
*Tg 135 to Tg 175 degreeC) |
Foils |
COPPER FOIL |
|
|
INNER LAYERS |
|
Foil Weight |
0.5 TO 4OZ |
Minimum Line Width |
0.004" |
Minimum Spacing |
0.004" |
|
|
OVERALL BRD. THICKNESS |
|
Max. overall brd. thickness |
0.125" |
Thickness tolerance |
|
Min. dielectric spacing |
0.003" |
|
|
HOLES |
|
Min. drilled hole diam. |
0.007 |
Max. drilled hole diam. |
0.25 |
Plated hole tolerance |
��0.002" |
|
|
Nonplated hole diam. Tolerance |
��0.002" |
Hole/hole location accuracy |
��0.001" |
Aspect ratio (finished) |
9:01 |
Other\ Sequential Lamination process |
|
|
|
SOLDERMASK |
|
Type: |
LPI MATTE/GLOSS |
Application |
AUTO SlLKSCREEN |
Controlled thickness |
YES |
Registration tolerance |
��0.003" |
Min. soldermask dam |
0.0023" |
Available colors |
GREEN ,RED,BLUE,BLACK |
|
|
VIA PLUGGING |
|
Type |
LPI THERMAL CURED |
Max. hole size |
0.030" |
Available colors |
LPI THERMAL CURED |
|
|
LEGEND |
|
Type |
Silkscreen |
Cure |
UV |
Available colors |
WHITE,BLANK,YELLOW |
Min. reproducible line |
0.006" |
Location accuracy |
0.003" |
Other |
|
|
|
SCORING |
|
Available angle |
30,45 DEGREE |
Jump score |
YES |
|
|
ROUTING |
|
Edge to datum tolerance? |
��0.004" |
Min. internal radius |
RO 4mm |
Rout tolerance |
��0.004" |
Conductor to board edge |
<0.007" rout< 0.020" screen? |
|
|
EDGE BEVELING |
|
Available angles |
20 to 60 DEGRESS |
Angle tolerance |
��5 DEGREE |
Available depth |
|
Depth tolerance |
��0.004" |
|
|
ELECTRICAL TEST |
|
Pitch |
|
Grid size |
0.012" |
Fixtureless |
FLYING PROBE TESTER |
Test voltage |
150~250V |
Net list capability |
GERBER NET LIST CAD CAM NET LIST |
|
|
FINISHES |
|
HASL |
40u" to 1000u" |
Nickel/gold tab fingers |
NI:50~200u" AU:5~20u" |
Deep tank hard gold |
8" |
ENIG (Electroless Ni /Immersion Au) |
NI:50~200u" AU:5~20u" |
OSP |
YES |
Silver in Hole |
YES |
Immersion Silver |
YES |
Immersion Tin |
YES |
Electrolytic Soft Gold |
YES |
Electroless Soft Gold |
YES |
Carbon Ink |
YES |
Eyelet pins |
|
Other |
impedance control |
|
|
LABORATORY |
|
Microsection |
YES |
Thermal stress |
YES |
Ionic contamination |
YES |
X-ray florescence |
YES |
Other |
|
|
|
Laser Direct Imaging |
|
Yag and CO2 Laser vias |
|