China Production - Manufacturing Capabilities

   
Description International Production
   
GENERAL  
Capacity (Avg. Daily) S/S 30K SQFT, D/S 15K SQFT, MLB 25K SQFT
Current Utilization 0.7
Panel Sizes (inches) 18*16, 18*24, 20*16, 21*24
Layer Counts 1 TO 36 LAYERS
Minimum DS lot size 250 WORKING PANELS
Minimum 4 layer lot size 200 WORKING
 
MATERIALS  
Laminates FR-1, FR-2, CEM-1, -3 (above for single sided) & FR-4 *Tg 135 to Tg 175 degreeC)
Foils COPPER FOIL
 
INNER LAYERS  
Foil Weight 0.5 TO 4OZ
Minimum Line Width 0.004"
Minimum Spacing 0.004"
 
OVERALL BRD. THICKNESS  
Max. overall brd. thickness 0.125"
Thickness tolerance  
Min. dielectric spacing 0.003"
 
HOLES  
Min. drilled hole diam. 0.007
Max. drilled hole diam. 0.25
Plated hole tolerance ��0.002"
 
Nonplated hole diam. Tolerance ��0.002"
Hole/hole location accuracy ��0.001"
Aspect ratio (finished) 9:01
Other\ Sequential Lamination process  
 
SOLDERMASK  
Type: LPI MATTE/GLOSS
Application AUTO SlLKSCREEN
Controlled thickness YES
Registration tolerance ��0.003"
Min. soldermask dam 0.0023"
Available colors GREEN ,RED,BLUE,BLACK
 
VIA PLUGGING  
Type LPI THERMAL CURED
Max. hole size 0.030"
Available colors LPI THERMAL CURED
 
LEGEND  
Type Silkscreen
Cure UV
Available colors WHITE,BLANK,YELLOW
Min. reproducible line 0.006"
Location accuracy 0.003"
Other  
 
SCORING  
Available angle 30,45 DEGREE
Jump score YES
 
ROUTING  
Edge to datum tolerance? ��0.004"
Min. internal radius RO 4mm
Rout tolerance ��0.004"
Conductor to board edge <0.007" rout< 0.020" screen?
 
EDGE BEVELING  
Available angles 20 to 60 DEGRESS
Angle tolerance ��5 DEGREE
Available depth  
Depth tolerance ��0.004"
 
ELECTRICAL TEST  
Pitch  
Grid size 0.012"
Fixtureless FLYING PROBE TESTER
Test voltage 150~250V
Net list capability GERBER NET LIST CAD CAM NET LIST
 
FINISHES  
HASL 40u" to 1000u"
Nickel/gold tab fingers NI:50~200u" AU:5~20u"
Deep tank hard gold 8"
ENIG (Electroless Ni /Immersion Au) NI:50~200u" AU:5~20u"
OSP YES
Silver in Hole YES
Immersion Silver YES
Immersion Tin YES
Electrolytic Soft Gold YES
Electroless Soft Gold YES
Carbon Ink YES
Eyelet pins  
Other impedance control
 
LABORATORY  
Microsection YES
Thermal stress YES
Ionic contamination YES
X-ray florescence YES
Other  
 
Laser Direct Imaging  
Yag and CO2 Laser vias